The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Oct. 25, 2018
Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Shinsei Mizuta, Kyoto, JP;

Satohiro Kigoshi, Kyoto, JP;

Takaaki Masaki, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/04 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 43/06 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); H01L 21/4828 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 24/48 (2013.01); H01L 24/97 (2013.01); H01L 43/065 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1711 (2013.01); H01L 2924/17151 (2013.01); H01L 2924/182 (2013.01);
Abstract

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.


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