The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Jul. 11, 2016
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Christian Leirer, Friedberg, DE;

Korbinian Perzlmaier, Regensburg, DE;

Anna Kasprzak-Zablocka, Donaustauf, DE;

Berthold Hahn, Hemau, DE;

Thomas Schwarz, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/0079 (2013.01); H01L 33/0095 (2013.01); H01L 33/22 (2013.01); H01L 33/382 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/52 (2013.01); H01L 33/647 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract

A component includes a carrier having a front side facing towards a semiconductor body and a rear side facing away from the semiconductor body, each of which is formed at least in places by a surface of a shaped body, a metal layer contains a first sub-region and a second sub-region, wherein the first sub-region and the second sub-region adjoin the shaped body in a lateral direction, are electrically connectable in a vertical direction on the front side of the carrier, are assigned to different electrical polarities of the component and are thus configured to electrically contact the semiconductor body, and the carrier has a side face running perpendicularly or obliquely to the rear side of the carrier and is configured as a mounting surface of the component, wherein at least one of the sub-regions is electrically connectable via the side face and exhibits singulation traces.


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