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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10535604 B1

PDFFull Text
Date of Patent:
Jan. 14, 2020

Filed:

Jun. 21, 2018

Stacked multilayer structure and manufacturing method thereof

Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Makoto Mizukami, Kawasaki, JP;

Takeshi Kamigaichi, Yokohama, JP;

Assignee:

TOSHIBA MEMORY CORPORATION, Minato-ku, TW;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Yu-Hsi D Sun

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 27/11578 (2017.01); H01L 27/1157 (2017.01); H01L 27/06 (2006.01); H01L 27/10 (2006.01); H01L 27/102 (2006.01); H01L 27/24 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 21/02 (2006.01); H01L 27/11556 (2017.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/0217 (2013.01); H01L 21/76805 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01); H01L 21/76883 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/0688 (2013.01); H01L 27/101 (2013.01); H01L 27/1021 (2013.01); H01L 27/1157 (2013.01); H01L 27/11556 (2013.01); H01L 27/11578 (2013.01); H01L 27/24 (2013.01); H01L 45/06 (2013.01); H01L 2924/0002 (2013.01); Y10T 156/1057 (2015.01);
Abstract

A stacked multilayer structure according to an embodiment of the present invention comprises: a stacked layer part including a plurality of conducting layers and a plurality of insulating layers, said plurality of insulating layers being stacked alternately with each layer of said plurality of conducting layers, one of said plurality of insulating layers being a topmost layer among said plurality of conducting layers and said plurality of insulating layers; and a plurality of contacts, each contact of said plurality of contacts being formed from said topmost layer and each contact of said plurality of contacts being in contact with a respective conducting layer of said plurality of conducting layers, a side surface of each of said plurality of contacts being insulated from said plurality of conducting layers via an insulating film.

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