The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Sep. 12, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thomas Krotscheck Ostermann, Koestenberg, AT;
Andrew Christopher Graeme Wood, St.Jakob i. Rosental, AT;
Peter Maier Brandl, Finkelstein, AT;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/485 (2006.01); H01L 21/768 (2006.01); H01L 21/3205 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/3205 (2013.01); H01L 21/76805 (2013.01); H01L 21/76838 (2013.01); H01L 23/485 (2013.01); H01L 23/3677 (2013.01); H01L 2924/0002 (2013.01);
Abstract
In one embodiment, a semiconductor device includes a first contact pad disposed at a top side of a workpiece, a second contact pad disposed at the top side of the workpiece. An isolation region is disposed between the first contact pad and the second contact pad. A metal strip is disposed at least partially within the isolation region. The metal strip is not coupled to an external potential node.