The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Feb. 28, 2018
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Anantharaj Thalaimalaivanaraj, Bangalore, IN;

Suman Tenugu, Bangalore, IN;

Arun Thandapani, Bangalore, IN;

Dharmaraju Marenahally Krishna, Bangalore, IN;

Sainath Viswasarai, Bangalore, IN;

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/22 (2006.01); G11C 7/10 (2006.01); G11C 29/12 (2006.01); G06F 11/10 (2006.01); G11C 29/52 (2006.01); G11C 16/26 (2006.01); G11C 7/04 (2006.01); G11C 11/56 (2006.01);
U.S. Cl.
CPC ...
G11C 7/22 (2013.01); G06F 11/1068 (2013.01); G11C 7/04 (2013.01); G11C 7/1057 (2013.01); G11C 7/1078 (2013.01); G11C 16/26 (2013.01); G11C 29/12 (2013.01); G11C 29/52 (2013.01); G11C 11/56 (2013.01);
Abstract

A die includes a plurality of memory cells. The die also includes a calculation circuit configured to determine a difference between a write temperature and a read temperature in response to a read request for user data stored in the memory cells. The die further includes a notification circuit configured to signal a cross-temperature condition in response to the difference satisfying a threshold.


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