The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Jan. 08, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yuki Maegawa, Osaka, JP;

Hideki Ueda, Aichi, JP;

Hideaki Fujiura, Osaka, JP;

Takeshi Uemura, Osaka, JP;

Hiroshi Nakatsuka, Osaka, JP;

Tsuyoshi Sakaue, Fukui, JP;

Rie Okamoto, Osaka, JP;

Shoya Kida, Fukui, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); G01P 1/02 (2006.01); G01P 15/125 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); H05K 5/0078 (2013.01); H05K 5/0091 (2013.01); H05K 5/0247 (2013.01); H05K 5/03 (2013.01); G01P 1/02 (2013.01);
Abstract

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.


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