The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Jun. 30, 2017
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Nobuyoshi Takeuchi, Osaka, JP;
Tsugihiro Matsuda, Kyoto, JP;
Hideo Nagai, Osaka, JP;
Masahiro Miki, Osaka, JP;
Yoshitaka Kurimoto, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/235 (2016.01); F21V 9/30 (2018.01); F21K 9/232 (2016.01); F21V 29/70 (2015.01); F21K 9/238 (2016.01); F21K 9/237 (2016.01); F21V 3/02 (2006.01); F21V 9/08 (2018.01); F21V 19/00 (2006.01); F21V 23/00 (2015.01); F21V 31/00 (2006.01); F21K 9/66 (2016.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); F21Y 105/10 (2016.01); F21K 9/64 (2016.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01); F21V 3/00 (2015.01); H01L 33/48 (2010.01); H01L 33/32 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
F21K 9/235 (2016.08); F21K 9/232 (2016.08); F21K 9/237 (2016.08); F21K 9/238 (2016.08); F21K 9/66 (2016.08); F21V 3/02 (2013.01); F21V 9/08 (2013.01); F21V 9/30 (2018.02); F21V 19/005 (2013.01); F21V 23/002 (2013.01); F21V 29/70 (2015.01); F21V 31/005 (2013.01); H01L 25/0753 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); F21K 9/64 (2016.08); F21V 3/00 (2013.01); F21Y 2103/10 (2016.08); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/32 (2013.01); H01L 33/48 (2013.01); H01L 33/502 (2013.01); H01L 33/647 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A light emitting module includes a base board having a first surface and a second surface opposing the first surface. A plurality of light-emitting diodes is provided on the first surface of the base board. A seal covers the plurality of light-emitting diodes, includes a wavelength conversion material, and covers the second surface of the base board.