The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Jul. 29, 2014
Applicant:
Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;
Inventor:
Shigekatsu Ohnishi, Osaka, JP;
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C09D 5/24 (2006.01); C23C 16/06 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C23C 16/06 (2013.01);
Abstract
A conductive paste having excellent electroconductivity and thermal conductivity is provided. A conductive paste comprising a conductive filler comprising a copper alloy powder comprising at least one transition metal belonging to group 8 to group 10 of the periodic table, and a carbon allotrope covering a surface of the copper alloy powder; and a binder resin.
Ohnishi, Shigekatsu. (2020). Conductive filler, method for producing same, conductive paste and method for producing conductive paste (U.S. Patent No. 10533098). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10533098
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile