The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Jan. 05, 2017
Applicant:

Asahi Rubber Inc., Saitama-shi, Saitama, JP;

Inventors:

Masutsugu Tasaki, Saitama, JP;

Naoto Igarashi, Saitama, JP;

Akira Ichikawa, Saitama, JP;

Tsutomu Odaki, Saitama, JP;

Maimi Yoshida, Saitama, JP;

Assignee:

ASAHI RUBBER INC., Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/33 (2006.01); B29C 48/00 (2019.01); B29C 45/14 (2006.01); C08G 77/04 (2006.01); C09D 183/04 (2006.01); H01L 31/0224 (2006.01); H01L 31/0352 (2006.01); H01L 31/048 (2014.01); H01L 31/068 (2012.01); H01L 33/60 (2010.01); C08L 83/04 (2006.01); H01L 31/054 (2014.01); C09D 7/62 (2018.01); B29C 59/04 (2006.01); C08K 3/22 (2006.01); C08K 9/02 (2006.01); C08K 9/06 (2006.01); C09C 1/36 (2006.01); C09C 3/12 (2006.01); H01L 31/02 (2006.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); B29C 48/07 (2019.01); B29C 48/08 (2019.01); B29C 48/13 (2019.01); B29C 48/16 (2019.01); B29C 48/154 (2019.01); B29C 48/155 (2019.01); B29K 705/10 (2006.01); B29L 7/00 (2006.01); B29D 11/00 (2006.01); B29K 83/00 (2006.01); B29K 105/20 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
C09D 5/004 (2013.01); B29C 45/14 (2013.01); B29C 48/002 (2019.02); B29C 48/0022 (2019.02); B29C 59/04 (2013.01); C08G 77/04 (2013.01); C08K 3/22 (2013.01); C08K 9/02 (2013.01); C08K 9/06 (2013.01); C08L 83/04 (2013.01); C09C 1/3684 (2013.01); C09C 3/12 (2013.01); C09D 7/62 (2018.01); C09D 183/04 (2013.01); H01L 31/02008 (2013.01); H01L 31/022425 (2013.01); H01L 31/03529 (2013.01); H01L 31/035281 (2013.01); H01L 31/048 (2013.01); H01L 31/0481 (2013.01); H01L 31/0547 (2014.12); H01L 31/068 (2013.01); H01L 31/0682 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); B29C 48/07 (2019.02); B29C 48/08 (2019.02); B29C 48/13 (2019.02); B29C 48/154 (2019.02); B29C 48/155 (2019.02); B29C 48/16 (2019.02); B29C 2793/0027 (2013.01); B29D 11/0074 (2013.01); B29K 2083/00 (2013.01); B29K 2105/20 (2013.01); B29K 2705/10 (2013.01); B29K 2995/003 (2013.01); B29L 2007/002 (2013.01); B29L 2009/005 (2013.01); C08K 2003/2241 (2013.01); H01L 2224/13 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); Y02E 10/52 (2013.01); Y02E 10/547 (2013.01); Y10T 428/24355 (2015.01); Y10T 428/24413 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/256 (2015.01); Y10T 428/269 (2015.01); Y10T 428/31663 (2015.04);
Abstract

A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.


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