The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Jul. 29, 2016
Applicants:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Trumpf Laser—und Systemtechnik Gmbh, Ditzingen, DE;
Inventors:
Hans-Georg Kinzelmann, Pulheim, DE;
Marcel Blodau, Krefeld, DE;
Martin Sauter, Korntal-Muenchingen, DE;
Michael Berger, Ditzingen-Hirschlanden, DE;
Assignees:
Henkel AG & Co. KGaA, Dusseldorf, DE;
Trumpf Laser—Und Systemtechnik GmbH, Ditzingen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/12 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); C09J 5/02 (2006.01); C09J 131/04 (2006.01); C09J 133/08 (2006.01); C09J 175/04 (2006.01); C09J 183/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/121 (2013.01); B32B 37/0015 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); B32B 37/1284 (2013.01); B32B 38/164 (2013.01); C08J 5/124 (2013.01); C09J 5/02 (2013.01); C09J 131/04 (2013.01); C09J 133/08 (2013.01); C09J 175/04 (2013.01); C09J 183/00 (2013.01); B32B 2037/1215 (2013.01); B32B 2307/538 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2309/14 (2013.01); B32B 2310/0806 (2013.01); B32B 2439/70 (2013.01); C08J 2331/04 (2013.01); C08J 2333/08 (2013.01); C08J 2375/04 (2013.01); C08J 2383/00 (2013.01); C09J 2205/306 (2013.01); C09J 2205/31 (2013.01);
Abstract
The invention relates to a method and a device for bonding two substrates, wherein an adhesive is applied to a first substrate and a second film-type substrate consisting of a thermoplastic material is converted into a plasticized state by heating before being bonded to the first substrate.