The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Apr. 20, 2015
Applicant:
Oji Holdings Corporation, Tokyo, JP;
Inventors:
Hayato Fushimi, Tokyo, JP;
Eiichi Mikami, Tokyo, JP;
Hiroki Tanaka, Tokyo, JP;
Jintong Han, Tokyo, JP;
Assignee:
OJI HOLDINGS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 27/12 (2006.01); D21H 27/32 (2006.01); B32B 5/02 (2006.01); D21H 19/80 (2006.01); D21H 19/84 (2006.01); B32B 15/082 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 15/092 (2006.01); B32B 15/095 (2006.01); B32B 15/098 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01); B32B 1/08 (2006.01); D21H 11/18 (2006.01); D21H 11/20 (2006.01);
U.S. Cl.
CPC ...
B32B 27/12 (2013.01); B32B 1/08 (2013.01); B32B 5/022 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/092 (2013.01); B32B 15/095 (2013.01); B32B 15/098 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/283 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/325 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); D21H 11/18 (2013.01); D21H 11/20 (2013.01); D21H 19/80 (2013.01); D21H 19/84 (2013.01); D21H 27/32 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2255/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/12 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2255/24 (2013.01); B32B 2255/26 (2013.01); B32B 2307/412 (2013.01); B32B 2307/422 (2013.01); B32B 2307/72 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/00 (2013.01); B32B 2457/12 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); B32B 2457/204 (2013.01); B32B 2457/206 (2013.01); B32B 2457/208 (2013.01); B32B 2590/00 (2013.01);
Abstract
It is an object to provide a composite in which the adhesion between a sheet layer and a curable resin layer or a film layer is high, and which has high strength and high transparency. The present invention provides a composite wherein a curable resin layer or a film layer is laminated on the one or both surfaces of the sheet layer with a covering layer interposed therebetween, the sheet layer containing fine fibers with an average fiber width of 2 to 1000 nm.