The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Sep. 10, 2015
Applicant:

Diamet Corporation, Niigata-shi, JP;

Inventors:

Shinichi Takezoe, Niigata, JP;

Yoshinari Ishii, Niigata, JP;

Assignee:

Diamet Corporation, Niigata-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/00 (2006.01); B22F 5/10 (2006.01); B22F 3/11 (2006.01); C22C 9/06 (2006.01); C22C 19/03 (2006.01); B22F 1/00 (2006.01); B22F 3/16 (2006.01); C22C 19/00 (2006.01); C22C 30/02 (2006.01); C22C 30/04 (2006.01); F16C 33/12 (2006.01); F16C 33/14 (2006.01); C22C 1/04 (2006.01); C22C 1/08 (2006.01); C22C 1/10 (2006.01);
U.S. Cl.
CPC ...
B22F 5/106 (2013.01); B22F 1/0003 (2013.01); B22F 3/11 (2013.01); B22F 3/16 (2013.01); C22C 1/0425 (2013.01); C22C 1/0433 (2013.01); C22C 1/08 (2013.01); C22C 1/1084 (2013.01); C22C 9/06 (2013.01); C22C 19/002 (2013.01); C22C 19/03 (2013.01); C22C 30/02 (2013.01); C22C 30/04 (2013.01); F16C 33/128 (2013.01); F16C 33/145 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2301/30 (2013.01); B22F 2302/40 (2013.01); B22F 2998/10 (2013.01); F16C 2204/10 (2013.01); F16C 2204/52 (2013.01);
Abstract

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of Ni—Cu alloy or Cu—Ni alloy, the Ni—Cu alloy and the Cu—Ni alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.


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