The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Jan. 29, 2018
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Mei Yang, Qinhuangdao, CN;

Yan Liu, Qinhuangdao, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/22 (2006.01); H05K 1/16 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 1/028 (2013.01); H05K 1/032 (2013.01); H05K 1/167 (2013.01); H05K 3/18 (2013.01); H05K 3/22 (2013.01); H05K 3/4673 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0929 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/088 (2013.01);
Abstract

A method for manufacturing a flexible circuit board with resistor which is buried in the board includes steps of providing a composite board, the composite board comprising a substrate, and a physical development core layer formed on the substrate. A silver halide emulsion layer is formed on the physical development core layer and the silver halide emulsion layer is exposed. A developing solution is applied to the halide emulsion layer and washed to form a silver layer on the substrate. A conductive layer is formed on the silver layer and the conductive layer is etched, forming at least one opening. Such opening exposes a portion of the silver layer which contains a buried resistor. Different processes and materials applied in the above procedure serve to increase or decrease the resistance of the resistor as desired.


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