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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10531557 B1

PDFFull Text
Date of Patent:
Jan. 07, 2020

Filed:

Nov. 07, 2018

Wireless module, rfid system, and wireless power supply device

Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Takafumi Nasu, Nagaokakyo, JP;

Tatsuya Hosotani, Nagaokakyo, JP;

Katsumi Taniguchi, Nagaokakyo, JP;

Makoto Takeoka, Nagaokakyo, JP;

Masaaki Kanao, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Jamara A Franklin

Int. Cl.
CPC ...
G06K 19/06 (2006.01); H05K 1/02 (2006.01); H01F 38/14 (2006.01); H02J 50/10 (2016.01); H04B 1/3883 (2015.01); H04B 1/525 (2015.01); H04B 5/00 (2006.01); H04B 5/02 (2006.01); H05K 3/46 (2006.01); H04B 1/3827 (2015.01); H01Q 1/52 (2006.01); H01Q 7/00 (2006.01); G06K 7/10 (2006.01); G06K 19/077 (2006.01); H05K 1/18 (2006.01); H05K 1/16 (2006.01); H02J 7/02 (2016.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); G06K 7/10366 (2013.01); G06K 19/07773 (2013.01); H01F 38/14 (2013.01); H01Q 1/52 (2013.01); H01Q 7/00 (2013.01); H02J 50/10 (2016.02); H04B 1/3827 (2013.01); H04B 1/3883 (2013.01); H04B 1/525 (2013.01); H04B 5/0031 (2013.01); H04B 5/0037 (2013.01); H04B 5/0062 (2013.01); H04B 5/0081 (2013.01); H04B 5/02 (2013.01); H05K 1/028 (2013.01); H05K 1/189 (2013.01); H05K 3/4691 (2013.01); H02J 7/025 (2013.01); H05K 1/165 (2013.01); H05K 2201/055 (2013.01); H05K 2201/056 (2013.01); H05K 2201/083 (2013.01); H05K 2201/086 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A wireless module includes a substrate that includes a first portion, a second portion, and a first flexible portion connecting the first portion and the second portion to each other. The first portion includes a circuit element that is mounted on the first main surface and a circuit including at least the circuit element. The second portion includes a first coil connected to the circuit. The first portion and the second portion face each other. A magnetic sheet is disposed on a second main surface of the second portion, and a battery is disposed between the second main surface of the first portion and the magnetic layer.

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