The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Jul. 25, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Han-Na Cho, Seongnam-si, KR;

Hye-Ji Yoon, Hwaseong-si, KR;

O-Ik Kwon, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); H01L 27/22 (2006.01); G11C 11/16 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); H01L 27/222 (2013.01); H01L 27/224 (2013.01); H01L 27/226 (2013.01); H01L 27/228 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); G11C 11/161 (2013.01);
Abstract

A method of manufacturing an MRAM device including forming a first insulating interlayer and a lower electrode contact, the lower electrode contact extending through the first insulating interlayer; forming a lower electrode layer, a magnetic tunnel junction layer, an upper electrode layer, and a first hard mask layer on the first insulating interlayer and lower electrode contact; forming a second hard mask on the first hard mask layer; etching the first hard mask layer and upper electrode layer to form a first hard mask and upper electrode; forming a spacer on sidewalls of the upper electrode and hard masks; and etching the magnetic tunnel junction layer and the lower electrode layer to form a structure including a lower electrode and a magnetic tunnel junction pattern on the lower electrode contact, wherein a layer remains on the upper electrode after etching the magnetic tunnel junction layer and the lower electrode layer.


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