The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Dec. 22, 2014
Applicant:

Material Concept, Inc., Sandai, Miyagi, JP;

Inventors:

Junichi Koike, Miyagi, JP;

Yuji Sutou, Miyagi, JP;

Daisuke Ando, Miyagi, JP;

Tri Hai Hoang, Miyagi, JP;

Assignee:

MATERIAL CONCEPT, INC., Sendai, Miyagi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01); H01L 31/068 (2012.01); H01L 31/0216 (2014.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022466 (2013.01); H01L 31/02168 (2013.01); H01L 31/022425 (2013.01); H01L 31/068 (2013.01); H01L 31/1884 (2013.01); Y02E 10/547 (2013.01);
Abstract

The present invention is provided with an interface layer that minimizes interdiffusion between a silicon substrate and copper electrode wiring that are used as a solar cell, that improves the adhesive properties of copper wiring, and that is used to obtain ohmic contact characteristics. This silicon solar cell comprises a silicon substrate and is provided with a metal oxide layer that is formed on the silicon substrate and wiring that is formed on the metal oxide layer and that comprises mainly copper. The metal oxide layer contains (a) one of either titanium or manganese, (b) one of vanadium, niobium, tantalum, or silicon, and (c) at least one of copper and nickel. In addition, the metal oxide layer comprises copper or nickel as metal particles that are diffused in the interior of the metal oxide layer.


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