The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Oct. 24, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Shoji Kobayashi, Kanagawa, JP;

Shin Iwabuchi, Kumamoto, JP;

Toshikazu Shibayama, Kumamoto, JP;

Mamoru Suzuki, Kanagawa, JP;

Shunsuke Maruyama, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/09 (2006.01); H04N 5/357 (2011.01); H04N 5/374 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14629 (2013.01); H01L 27/1464 (2013.01); H01L 27/14636 (2013.01); H01L 31/09 (2013.01); H04N 5/357 (2013.01); H04N 5/374 (2013.01);
Abstract

The present disclosure relates to a semiconductor device, a solid state imaging element, and an electronic apparatus in which the adverse effect due to hot carrier luminescence can be suppressed. In them, an element formation unit in which a plurality of elements are formed and an interconnection unit in which interconnections connecting elements are formed are stacked. A structure object formed between a light receiving element that receives light and performs photoelectric conversion and an active element that forms a peripheral circuit placed around the light receiving element in such a manner that the gap in the thickness direction of the element formation unit is not more than a prescribed spacing and formed of a material that inhibits the propagation of light is placed in the element formation unit. The present technology can be applied to a back-side illumination solid state imaging element, for example.


Find Patent Forward Citations

Loading…