The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
May. 13, 2019
Applicant:
Pixart Imaging Inc., Hsin-Chu, TW;
Inventor:
Chi-Chih Shen, Hsin-Chu, TW;
Assignee:
PIXART IMAGING INC., Hsin-Chu, Taiwan, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G06F 21/32 (2013.01); G06K 9/00 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); G06F 21/32 (2013.01); G06K 9/00013 (2013.01); H01L 23/3121 (2013.01); H01L 25/167 (2013.01); H01L 27/1469 (2013.01); H01L 27/14621 (2013.01); H01L 27/14685 (2013.01);
Abstract
An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.