The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Mar. 19, 2017
Applicant:
Smart Modular Technologies, Inc., Newark, CA (US);
Inventors:
Satyanarayan Shivkumar Iyer, Fremont, CA (US);
Reuben J. Chang, Campbell, CA (US);
Victor Mahran, Ladera Ranch, CA (US);
Assignee:
SMART Modular Technologies, Inc., Newark, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/3511 (2013.01); H05K 2201/10515 (2013.01);
Abstract
A system and method of manufacture of an integrated circuit device system includes mounting a first elevated device on a first riser positioned adjacent to a base device. The first elevated device includes a first device overhang that extends over the base device. A second elevated device can be mounted on a second riser adjacent to the first riser to allow the attachment of a second elevated device mounted above the first elevated device to achieve higher component densities.