The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
May. 03, 2017
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventor:
Chih Hung Wei, Hsinchu, TW;
Assignee:
CYNTEC CO., LTD, Hsinchu, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01F 17/00 (2006.01); H01F 27/34 (2006.01); H01L 49/02 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01F 17/0013 (2013.01); H01F 27/34 (2013.01); H01L 21/302 (2013.01); H01L 28/10 (2013.01);
Abstract
A conductive element made of magnetic layers each being made of a first magnetic material, a trench is formed in each of the magnetic layer with the bottom surface of the trench being located higher than the bottom surface of the magnetic layer, wherein a second material is disposed in the trench and a conductive layer is disposed over the trench for forming the conductive element.
Wei, Chih. (2020). Multilayer inductor and the fabrication method thereof (U.S. Patent No. 10529661). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10529661
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile