The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Nov. 19, 2015
Applicant:

Advanced Micro-fabrication Equipment Inc, Shanghai, Shanghai, CN;

Inventors:

TuQiang Ni, Shanghai, CN;

ZhiLin Huang, Shanghai, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3065 (2013.01); H01J 37/321 (2013.01); H01J 37/32449 (2013.01); H01J 37/32623 (2013.01); H01J 37/32633 (2013.01);
Abstract

The present invention relates to a device of changing the gas flow pattern in the process chamber and a wafer processing method and system; a gas introduced from the gas inlet to the process chamber will process the wafer in the process chamber; a gas center ring is set in the process chamber to adjust the gas flow pattern, which includes a fixed component under the gas inlet and above the wafer, and a movable ring could locate in the first position or the second position respectively; when the movable ring is in the first position, the gas is delivered downwards to the wafer via the first opening set on the fixed component; when the movable ring is in the second position, the gas is delivered downwards to the wafer via the second opening set on the movable ring. The present invention constitutes the gas center ring by different combinations of fixed component and movable component, to change the gas flow pattern in the process chamber, achieving effective control on the wafer processing effects and to dispense with opening the process chamber during the adjustment process of gas center ring.


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