The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Sep. 19, 2016
Applicant:

Analog Devices Global, Hamilton, BM;

Inventors:

Padraig Liam Fitzgerald, Mallow, IE;

Srivatsan Parthasarathy, Acton, MA (US);

Javier A. Salcedo, North Billerica, MA (US);

Assignee:

Analog Devices Global, Hamilton, BM;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02H 9/00 (2006.01); H01H 59/00 (2006.01); H01L 27/02 (2006.01); H01L 23/31 (2006.01); H02H 9/04 (2006.01); B81C 1/00 (2006.01); H01L 27/12 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01H 59/0009 (2013.01); B81C 1/0023 (2013.01); B81C 1/00246 (2013.01); H01L 23/3107 (2013.01); H01L 27/0255 (2013.01); H01L 27/0262 (2013.01); H02H 9/041 (2013.01); H02H 9/046 (2013.01); B81C 2203/0735 (2013.01); H01L 23/49541 (2013.01); H01L 27/1203 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01);
Abstract

Micro-electromechanical switch (MEMS) devices can be fabricated using integrated circuit fabrication techniques and materials. Such switch devices can provide cycle life and insertion loss performance suiting for use in a broad range of applications including, for example, automated test equipment (ATE), switching for measurement instrumentation (such as a spectrum analyzer, network analyzer, or communication test system), and uses in communication systems, such as for signal processing. MEMS devices can be vulnerable to electrical over-stress, such as associated with electrostatic discharge (ESD) transient events. A solid-state clamp circuit can be incorporated in a MEMS device package to protect one or more MEMS devices from damaging overvoltage conditions. The clamp circuit can include single or multiple blocking junction structures having complementary current-voltage relationships, such as to help linearize a capacitance-to-voltage relationship presented by the clamp circuit.


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