The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Mar. 25, 2015
Applicant:

Heraeus Sensor Technology Gmbh, Hanau, DE;

Inventors:

Thomas Loose, Linsengericht, DE;

Stefan Dietmann, Alzenau, DE;

Alfred Fleckenstein, Heinrichsthal, DE;

Dieter Teusch, Bruchköbel, DE;

Assignee:

HERAEUS NEXENSOS GMBH, Kleinostheim, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 1/016 (2006.01); H01C 7/00 (2006.01); G01K 7/18 (2006.01); H01C 3/12 (2006.01); H01C 17/08 (2006.01); H01C 17/065 (2006.01); H05B 3/12 (2006.01); H01C 17/075 (2006.01); G01N 15/00 (2006.01); G01N 15/06 (2006.01);
U.S. Cl.
CPC ...
H01C 1/016 (2013.01); G01K 7/183 (2013.01); H01C 3/12 (2013.01); H01C 7/006 (2013.01); H01C 17/065 (2013.01); H01C 17/06526 (2013.01); H01C 17/075 (2013.01); H01C 17/08 (2013.01); H05B 3/12 (2013.01); G01N 15/0606 (2013.01); G01N 15/0656 (2013.01); G01N 2015/0046 (2013.01);
Abstract

An AlOcarrier has a thin-film structure of platinum or a platinum alloy arranged thereon. The carrier and/or the thin-film structure are adapted to reduce mechanical stresses owing to different thermal expansion coefficients. The carrier and/or the thin-film structure include a surface of the carrier in the region of the thin-film structure is smoothed at least in sections to reduce the adhesion and/or a surface of the carrier has an intermediate layer on which the thin-film structure is arranged. The thermal expansion coefficient of the intermediate layer is from 8*10/K to 16*10/K, in particular from 8.5*10/K to 14*10/K, and/or the thin-film structure has at least one conductor path that is undular at least in sections, said conductor path extends laterally along the surface of the carrier.


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