The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Oct. 22, 2015
Applicant:

Nissha Printing Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Hideaki Nada, Kyoto, JP;

Hiroaki Uefuji, Kyoto, JP;

Hirotaka Shigeno, Kyoto, JP;

Yoshihiro Sakata, Kyoto, JP;

Yuki Matsui, Kyoto, JP;

Hisaya Takayama, Kyoto, JP;

Assignee:

NISSHA CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); G06F 3/044 (2006.01); H01B 5/14 (2006.01); G03F 7/09 (2006.01); G03F 7/11 (2006.01); H01B 13/00 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); G03F 7/094 (2013.01); G03F 7/11 (2013.01); G06F 3/044 (2013.01); H01B 5/14 (2013.01); H01B 13/003 (2013.01); H05K 9/0088 (2013.01); H05K 9/0096 (2013.01); G06F 2203/04103 (2013.01);
Abstract

[Object] To provide a method for producing an electrical wiring member having a layered structure of copper wiring and a blackening layer and to provide the electrical wiring member through a search for a material for the blackening layer, the material being etched at a rate close to that for the copper wiring under conditions where etching controllability is ensured. [Solution] A method for producing an electrical wiring member according to the present invention includes a step of forming, on at least one main surface of a substrate, a layered filmof a Cu layerand CuNO-based blackening layers (and); a step of forming a resist layerin a predetermined region on the layered film; and a step of removing a partial region of the layered filmby bringing the layered filminto contact with an etchant.


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