The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Dec. 08, 2017
Applicant:

L3 Technologies, Inc., New York, NY (US);

Inventors:

Michael G. Abernathy, Ellijay, GA (US);

Mark W. Fletcher, Hiawassee, GA (US);

Sanjay Tripathi, Cumming, GA (US);

Assignee:

L3 TECHNOLOGIES, INC., New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); H01L 23/552 (2006.01); H01L 27/12 (2006.01); G02F 1/1333 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1362 (2013.01); G02F 1/133345 (2013.01); H01L 23/552 (2013.01); H01L 27/1214 (2013.01); G02F 1/133305 (2013.01); G02F 2001/133334 (2013.01); G02F 2001/136222 (2013.01); G02F 2201/50 (2013.01); H01L 27/3244 (2013.01);
Abstract

Various circuits may benefit from suitable protection. For example, certain displays, such as active matrix liquid crystal displays, may benefit from enclosures configured to protect driver circuits from high intensity radiated fields. A system can include a first protective conductive coating layer. The system can also include a first insulating layer on the first protective conductive layer. The system can further include a signal conductive layer on the insulating layer. The system can additionally include a driver layer mounted to the signal conductive layer. The system can also include a second insulating layer above the driver layer. The system can further include a second protective conductive coating layer on the second insulating layer. The system can additionally include one or a plurality of conductive elements disposed between the first protective conductive coating layer and the second protective conductive coating layer to form an enclosure around the driver layer.


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