The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Jan. 11, 2019
Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Inventor:

Hiroshi Hara, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01S 5/022 (2006.01); H01L 23/495 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4257 (2013.01); G02B 6/4295 (2013.01); G02B 6/43 (2013.01); H01L 23/49579 (2013.01); H01S 5/02248 (2013.01);
Abstract

An optical module that provides a bridge substrate for carrying a driving signal from a wiring substrate to a laser diode (LD) element is disclosed. The optical module provides a carrier, first and second assemblies, and the bridge substrate. The first assembly, which includes the LD element, stacks a first compensating substrate and a semiconductor substrate on the carrier, where the semiconductor substrate includes the LD element. The second assembly stacks a second compensating substrate and the wiring substrate on the carrier. The first compensating substrate is made of a material same with a material of the wiring substrate and has a thickness same with that of the wiring substrate. The second compensating substrate is made of a material same with a material of the semiconductor substrate and has a thickness same with that of the semiconductor substrate.


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