The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Feb. 08, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yves Martin, Ossining, NY (US);

Jason S. Orcutt, Katonah, NY (US);

Tymon Barwicz, Yorktown Heights, NY (US);

William Green, Irvington, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/125 (2006.01); G02B 6/124 (2006.01); G02B 6/136 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/124 (2013.01); G02B 6/125 (2013.01); G02B 6/136 (2013.01); G02B 2006/12142 (2013.01); G02B 2006/12164 (2013.01);
Abstract

Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.


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