The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Mar. 15, 2018
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kunihiro Ueda, Tokyo, JP;

Koichi Otani, Tokyo, JP;

Hiraku Hirabayashi, Tokyo, JP;

Shuhei Miyazaki, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/00 (2006.01); G01R 33/09 (2006.01); G01R 33/07 (2006.01); G01R 33/12 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0047 (2013.01); G01R 33/0005 (2013.01); G01R 33/07 (2013.01); G01R 33/09 (2013.01); G01R 33/1276 (2013.01); H01L 2224/48247 (2013.01);
Abstract

A magnetic sensor device comprises a magnetic sensor chip that has a substantially rectangular shape and that contains a magnetic sensor element; and a sealing body, which is composed of a resin material containing magnetic particles and that integrally seals the chip. The chip includes a first and second side surfaces which are mutually opposite to each other, and a third and fourth side surfaces which are mutually opposite to each other and orthogonal to the first and second side surfaces. The sealing body contains first to forth sealing parts. The thicknesses of the first and second sealing parts are smaller than the particle diameter of the particles, and the thickness of at least the third sealing part is larger than the particle diameter of the particles. The particles exist in at least the third sealing part and substantially do not exist in the first and second sealing parts.


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