The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Jan. 11, 2018
Applicant:
Cooper Technologies Company, Houston, TX (US);
Inventor:
Scott David Wegner, Peachtree City, GA (US);
Assignee:
Eaton Intelligent Power Limited, Dublin, IE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/62 (2016.01); F21V 19/00 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01); F21V 8/00 (2006.01); F21Y 105/16 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/62 (2016.08); F21V 19/0015 (2013.01); G02B 6/0051 (2013.01); G02B 6/0068 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); F21Y 2105/16 (2016.08); F21Y 2115/10 (2016.08); H01L 33/58 (2013.01);
Abstract
A lighting system includes a chip scale package light emitting diode mounted to a substrate and covered by an optic. The chip scale package light emitting diode has six faces with the top face and the four side faces operative to emit light and the bottom face oriented toward the substrate. The optic includes a lower face with a cavity in which the chip scale package light emitting diode is at least partially disposed.