The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2020
Filed:
Jan. 13, 2017
Applicant:
Dexerials Corporation, Shinagawa-ku, Tokyo, JP;
Inventors:
Hiroki Kanaya, Tokyo, JP;
Yu Nomura, Tokyo, JP;
Shunsuke Uchida, Tokyo, JP;
Shinichi Uchida, Tokyo, JP;
Keisuke Aramaki, Tokyo, JP;
Assignee:
Dexerials Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); C09K 5/14 (2006.01); C08K 3/04 (2006.01); H01L 23/373 (2006.01); C08J 5/18 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 7/06 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08J 5/18 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 7/06 (2013.01); H01L 23/3675 (2013.01); H01L 23/373 (2013.01); H01L 23/3731 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); C08J 2383/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2201/001 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/27602 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83101 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16724 (2013.01); H01L 2924/16747 (2013.01);
Abstract
A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.