The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Nov. 30, 2015
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Shotaro Watanabe, Suwa, JP;

Takuya Sonoyama, Fujimi-machi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/50 (2014.01); C09D 11/033 (2014.01); C09D 11/106 (2014.01); C09D 11/36 (2014.01); C09D 11/38 (2014.01); C09D 11/52 (2014.01); C09K 11/02 (2006.01); C09K 11/06 (2006.01); H01L 51/00 (2006.01); H01L 51/50 (2006.01); G02B 5/20 (2006.01); C09K 11/66 (2006.01);
U.S. Cl.
CPC ...
C09D 11/50 (2013.01); C09D 11/033 (2013.01); C09D 11/106 (2013.01); C09D 11/36 (2013.01); C09D 11/38 (2013.01); C09D 11/52 (2013.01); C09K 11/02 (2013.01); C09K 11/06 (2013.01); C09K 11/661 (2013.01); H01L 51/004 (2013.01); H01L 51/005 (2013.01); H01L 51/0043 (2013.01); H01L 51/0078 (2013.01); H01L 51/0081 (2013.01); H01L 51/0085 (2013.01); H01L 51/0087 (2013.01); H01L 51/0091 (2013.01); C09K 2211/1011 (2013.01); C09K 2211/1029 (2013.01); C09K 2211/1425 (2013.01); C09K 2211/185 (2013.01);
Abstract

A film-forming ink includes a film-forming material and a liquid medium in which the film-forming material is dissolved or dispersed. The liquid medium contains a first component which has a viscosity of less than 20 cp and a second component which has a boiling point at an atmospheric pressure within a range of ±30° C. relative to the boiling point at an atmospheric pressure of the first component and has a viscosity of 20 cp or more, and the second component is contained in an amount of 20 parts by weight or more and 500 parts by weight or less with respect to 100 parts by weight of the first component.


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