IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10526452 B1

PDFFull Text
Date of Patent:
Jan. 07, 2020

Filed:

Apr. 20, 2015

Method for producing cured product of episulfide-based resin

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Kousuke Namiki, Tokyo, JP;

Sawako Fuse, Tokyo, JP;

Eiji Koshiishi, Tokyo, JP;

Kikuo Furukawa, Tokyo, JP;

Hiroshi Horikoshi, Tokyo, JP;

Assignee:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery LLP

Primary Examiner:

Alex A Rolland

Int. Cl.
CPC ...
C08G 75/08 (2006.01); B29C 39/02 (2006.01); B29C 39/24 (2006.01); B29C 39/38 (2006.01); G02B 1/04 (2006.01); G02C 7/00 (2006.01); B29B 7/88 (2006.01); B29C 35/04 (2006.01); B29C 45/00 (2006.01); B29D 11/00 (2006.01); B29C 67/24 (2006.01); B29K 81/00 (2006.01); B29L 11/00 (2006.01); G02C 7/02 (2006.01);
U.S. Cl.
CPC ...
C08G 75/08 (2013.01); B29B 7/88 (2013.01); B29C 35/041 (2013.01); B29C 39/02 (2013.01); B29C 39/24 (2013.01); B29C 39/38 (2013.01); B29C 45/0001 (2013.01); B29C 67/246 (2013.01); B29D 11/00009 (2013.01); G02B 1/04 (2013.01); G02B 1/041 (2013.01); G02C 7/00 (2013.01); B29K 2081/00 (2013.01); B29K 2081/04 (2013.01); B29L 2011/0016 (2013.01); C08G 2120/00 (2013.01); G02C 7/02 (2013.01);
Abstract

The present invention can provide a method for producing a cured product of an episulfide-based resin, the method having: (A) a step for obtaining a composition for a resin by mixing compound (a), compound (b) and a polymerization catalyst; (B) a step for pouring the composition for a resin into a mold; and (C) a step in which, by increasing the temperature of a heating medium, the composition for a resin is polymerized in the heating medium that contains a liquid having a thermal conductivity of 0.2 W/m·K or higher, or in a shower of the heating medium. The maximum temperature of the heating medium in step (C) is 55 to 110° C. wherein m represents an integer from 0 to 4 and n represents an integer from 0 to 2

Find Patent Forward Citations

Loading…