The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2020

Filed:

Feb. 24, 2017
Applicant:

SK Siltron Co., Ltd., Gumi-si, Gyeongsangbuk-do, KR;

Inventors:

Seung Won Baek, Gumi-si, KR;

Jae Pyo Lee, Gumi-si, KR;

Assignee:

SK SILTRON CO., LTD., Gumi-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); B24B 37/34 (2012.01); B24B 57/02 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 37/04 (2013.01); B24B 37/34 (2013.01);
Abstract

The wafer polishing system is disclosed. The wafer polishing system may comprise a polishing unit; a slurry distribution unit mounted on the polishing unit and distributing a slurry flowing into the polishing unit for wafer polishing; a slurry tank connected to the slurry distribution unit and storing the slurry; a slurry pump connected to the polishing unit and the slurry tank for transferring the slurry from the slurry tank to the polishing unit; a first circulation line in which one side is connected to the slurry tank; a second circulation line in which one side is connected to the other side of the first circulation line and the other side is connected to the slurry distribution unit; and a cleaning liquid supply unit connected to the second circulation line for supplying a cleaning liquid flowing through the second circulation line.


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