The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Jan. 06, 2012
Applicant:
Anja Henckens, Zonhoven, BE;
Inventor:
Anja Henckens, Zonhoven, BE;
Assignee:
HENKEL AG & CO. KGAA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/22 (2006.01); H01B 1/22 (2006.01); C09J 9/02 (2006.01); H05K 3/32 (2006.01); B32B 5/16 (2006.01); C08K 3/02 (2006.01); C09J 163/00 (2006.01); C08K 3/08 (2006.01); B32B 27/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); C09J 9/02 (2013.01); H01B 1/22 (2013.01); B32B 5/16 (2013.01); B32B 27/38 (2013.01); B32B 2305/30 (2013.01); B32B 2307/202 (2013.01); B32B 2311/08 (2013.01); B32B 2405/00 (2013.01); B32B 2457/12 (2013.01); C08K 3/02 (2013.01); C08K 2003/0806 (2013.01); C09J 163/00 (2013.01); C09J 2400/16 (2013.01); H05K 2203/0425 (2013.01); Y10T 428/31515 (2015.04);
Abstract
The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.