The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Sep. 08, 2017
Applicant:
Mems Drive, Inc., Pasadena, CA (US);
Inventors:
Assignee:
MEMS Drive, Inc., Arcadia, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H02N 1/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H02N 1/06 (2006.01); H02N 2/02 (2006.01); H01L 41/053 (2006.01); G02B 27/64 (2006.01); B81B 7/00 (2006.01); H01L 41/09 (2006.01); H01L 41/25 (2013.01); H04N 5/225 (2006.01); G02B 7/09 (2006.01); G02B 7/10 (2006.01);
U.S. Cl.
CPC ...
H02N 1/008 (2013.01); B81B 3/0021 (2013.01); B81B 3/0035 (2013.01); B81B 3/0037 (2013.01); B81B 3/0051 (2013.01); B81B 3/0062 (2013.01); B81B 3/0072 (2013.01); B81B 7/0016 (2013.01); B81C 1/00007 (2013.01); B81C 1/00269 (2013.01); B81C 1/00301 (2013.01); G02B 27/646 (2013.01); H01L 41/0536 (2013.01); H01L 41/0953 (2013.01); H01L 41/25 (2013.01); H02N 1/06 (2013.01); H02N 2/02 (2013.01); H02N 2/028 (2013.01); B81B 2201/03 (2013.01); B81B 2201/033 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0136 (2013.01); B81B 2203/0145 (2013.01); B81B 2203/051 (2013.01); B81B 2203/053 (2013.01); B81B 2207/03 (2013.01); B81C 2201/019 (2013.01); B81C 2203/032 (2013.01); B81C 2203/038 (2013.01); G02B 7/09 (2013.01); G02B 7/10 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2259 (2013.01);
Abstract
A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.