The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Jun. 25, 2018
Applicants:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Stmicroelectronics (Alps) Sas, Grenoble, FR;

Inventors:

David Auchere, Meylan, FR;

Laurent Marechal, Bures sur Yvette, FR;

Yvon Imbs, Quaix en Chartreuse, FR;

Laurent Schwarz, La Buisse, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/66 (2006.01); H01L 21/3105 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/3105 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01);
Abstract

An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.


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