The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Dec. 11, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Marcel Blech, The Hague, NL;

Ali Eray Topak, Stuttgart, DE;

Arndt Thomas Ott, Bissingen an der Teck, DE;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/02 (2006.01); H01P 5/107 (2006.01); H01P 3/12 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H01P 5/107 (2013.01); H01P 3/121 (2013.01); H01Q 1/38 (2013.01); H01Q 13/0283 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A microwave antenna apparatus includes: a redistribution layer including a carrier layer, a ground plane arranged on a first or second surface of the carrier layer, and a microstrip line arranged on the other one of the first or second surface of the carrier layer; a semiconductor element mounted on the first surface of the carrier layer and coupled to the ground plane and the microstrip line; a mold layer that covers the semiconductor element and the first surface of the carrier layer; and a waveguide arranged within the mold layer and on the first surface of the carrier layer and coupled to the semiconductor element by the microstrip line, wherein a solid state filling material is arranged within the waveguide. Further, integrated antennas and transitions are presented within eWLB packages.


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