The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Sep. 07, 2018
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Hyun Jee Yoo, Daejeon, KR;
Seung Min Lee, Daejeon, KR;
Hyun Suk Kim, Daejeon, KR;
Suk Ky Chang, Daejeon, KR;
Jung Ok Moon, Daejeon, KR;
Assignee:
LG Chem, Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 51/004 (2013.01); H01L 51/0035 (2013.01); H01L 51/0043 (2013.01); H01L 51/5256 (2013.01); H01L 51/56 (2013.01); H01L 51/5243 (2013.01); H01L 51/5259 (2013.01); H01L 2251/303 (2013.01); H01L 2251/558 (2013.01);
Abstract
Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.
Yoo, Hyun. (2019). Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns (U.S. Patent No. 10522786). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10522786
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile