The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
May. 30, 2019
Applicant:
Shenzhen China Star Optoelectronics Technology Co., Ltd, Shenzhen, Guangdong, CN;
Inventor:
Haijun Wang, Guangdong, CN;
Assignee:
Shenzhen China Star Optoelectronics Technology Co., Ltd, Shenzhen, Guangdong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/48 (2010.01); C08K 3/04 (2006.01); C08K 9/04 (2006.01); C08L 101/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08K 3/04 (2013.01); C08K 9/04 (2013.01); C08L 101/00 (2013.01); H01L 33/005 (2013.01); H01L 33/483 (2013.01); C08L 2201/08 (2013.01); C08L 2203/206 (2013.01);
Abstract
A light-emitting diode (LED) packaging material is formed by compounding graphene with silane or epoxy resin, to improve the defects of manufacturing an LED packaging material only of silane or epoxy resin. The addition of graphene helps improve the performance of the LED packaging material. Also provided is a manufacturing method of a LED packaging material.