The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Oct. 03, 2018
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventor:

Matthew Charles, Grenoble, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/205 (2006.01); H01L 29/205 (2006.01); C30B 25/10 (2006.01); C30B 25/16 (2006.01); C30B 25/18 (2006.01); C30B 29/40 (2006.01); C30B 33/12 (2006.01); H01L 21/306 (2006.01); H01L 29/20 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); C30B 25/10 (2013.01); C30B 25/16 (2013.01); C30B 25/183 (2013.01); C30B 29/406 (2013.01); C30B 33/12 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02458 (2013.01); H01L 21/02505 (2013.01); H01L 21/02579 (2013.01); H01L 21/02634 (2013.01); H01L 21/2056 (2013.01); H01L 21/30621 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/4236 (2013.01); H01L 29/66522 (2013.01); H01L 29/7787 (2013.01);
Abstract

The invention relates to a process for manufacturing a heterojunction electronic component provided with an embedded barrier layer, the process comprising: depositing by epitaxy, in a vapour phase epitaxial growth chamber with an atmosphere exhibiting a first nonzero ammonia concentration, of a GaN precursor layer of the embedded barrier layer, comprising a first layer doped with a Mg or Fe dopant; placing, while maintaining the substrate in the chamber, the atmosphere at a second ammonia concentration at most equal to a third of the first concentration, in order to remove an upper part of the precursor layer; and then after the removal of the said upper part, while maintaining the substrate in the chamber, depositing by epitaxy of a layer of semiconductor material of the heterojunction electronic component to be manufactured, the said precursor layer then forming the embedded barrier layer under the said layer of semiconductor material.


Find Patent Forward Citations

Loading…