The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Feb. 08, 2018
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Keiichi Sawa, Yokkaichi, JP;

Kazuhisa Matsuda, Yokkaichi, JP;

Atsushi Takahashi, Yokkaichi, JP;

Takaumi Morita, Yokkaichi, JP;

Masayuki Tanaka, Yokkaichi, JP;

Shinji Mori, Nagoya, JP;

Kazuhiro Matsuo, Kuwana, JP;

Yuta Saito, Yokkaichi, JP;

Kenichiro Toratani, Kuwana, JP;

Hisashi Okuchi, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); G11C 13/00 (2006.01); H01L 27/108 (2006.01); H01L 45/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/249 (2013.01); G11C 13/0002 (2013.01); H01L 45/1253 (2013.01); H01L 45/1683 (2013.01); G11C 13/0007 (2013.01); G11C 2213/51 (2013.01); G11C 2213/71 (2013.01); G11C 2213/81 (2013.01); H01L 27/10808 (2013.01); H01L 27/10817 (2013.01); H01L 27/2409 (2013.01);
Abstract

In one embodiment, a semiconductor storage device includes a first interconnect extending in a first direction, a plurality of second interconnects extending in a second direction different from the first direction, and a plurality of first insulators provided alternately with the second interconnects. The device further includes a resistance change film provided between the first interconnect and at least one of the second interconnects and including a first metal layer or a first semiconductor layer that includes a first face provided on a first interconnect side and a second face provided on a second interconnect side, at least any of the first face and the second face having a curved plane shape.


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