The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

May. 10, 2017
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Akihiro Chida, Kanagawa, JP;

Tatsuya Sakuishi, Kanagawa, JP;

Daiki Nakamura, Kanagawa, JP;

Tomoya Aoyama, Kanagawa, JP;

Kohei Yokoyama, Kanagawa, JP;

Daisuke Kubota, Kanagawa, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1266 (2013.01); H01L 27/124 (2013.01); H01L 27/3262 (2013.01); H01L 27/3276 (2013.01); H01L 51/0021 (2013.01); H01L 29/7869 (2013.01); H01L 29/78648 (2013.01); H01L 51/003 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A method for manufacturing a display device is provided. The method includes a step of forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode, a step of forming a second layer over a second substrate, a step of attaching the first substrate to the second substrate with a bonding layer therebetween, a step of separating the first substrate from the first layer, a step of attaching a third substrate to the first layer, a step of separating the second substrate from the second layer together with part of the bonding layer, and a step of attaching a fourth substrate to the second layer. At least one of the first layer and the second layer includes an organic film.


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