The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Oct. 08, 2018
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventor:

James Karp, Saratoga, CA (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); G02B 6/42 (2006.01); H04B 10/80 (2013.01); H01L 23/60 (2006.01); H04B 10/60 (2013.01); H04B 10/50 (2013.01); H04B 10/40 (2013.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); G02B 6/4275 (2013.01); H01L 23/60 (2013.01); H04B 10/801 (2013.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); H04B 10/60 (2013.01);
Abstract

An integrated circuit device is described. The integrated circuit device comprises a substrate having transmitter for receiving a signal to be transmitted to a receiver of the substrate by way of a transmission channel; a first plurality of contacts adapted to receive a first integrated circuit die, wherein a contact of the first plurality of contacts is adapted to receive the signal to be transmitted by the transmitter; a second plurality of contacts adapted to receive a second integrated circuit die, wherein a contact of the second plurality of contacts is adapted to receive the signal transmitted by the transmitter and received by the receiver; a first resistive element coupled between a contact of the first plurality of contacts and the transmitter; and a second resistive element coupled between a contact of the second plurality of contacts and the receiver. A method of transmitting data in an integrated circuit is also described.


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