The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Mar. 16, 2019
Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
Broadpak Corporation, San Jose, CA (US);
Farhang Yazdani, Santa Clara, CA (US);
BroadPak Corporation, San Jose, CA (US);
Abstract
A system comprising a die stack having at least a first die and a second die; one or more Redistribution Layer(s); one or more Through Silicon Via(s); one or more Serial I/O(s); one or more contact pad(s); and a substrate. The die stack is configured to communicate through said one or more Redistribution Layer(s) and said Through Silicon Via(s). The first die and/or said second die is/are configured to communicate through said one or more Redistribution Layer(s) and said Through Silicon Via(s). The one or more Serial I/O(s) is/are configured to communicate through said one or more Redistribution Layer(s) and said Through Silicon Via(s).