The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Dec. 06, 2016
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Yasuo Fukuhara, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/36 (2006.01); C08L 71/02 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/3613 (2013.01); C08L 71/02 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); B23K 2101/40 (2018.08); C08L 2203/20 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01);
Abstract
Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100° C. to 240° C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.