The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Dec. 27, 2017
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventor:
Yoshihiro Kodaira, Shenzhen, CN;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/055 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H02M 7/537 (2006.01);
U.S. Cl.
CPC ...
H01L 23/055 (2013.01); H01L 23/053 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/49811 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 23/49844 (2013.01); H02M 7/537 (2013.01);
Abstract
A semiconductor device is provided. The semiconductor device includes a terminal portion and a casing portion. The terminal portion has a through hole in a principal surface portion. The casing portion has a depression at a position facing the through hole and has an end surface facing portion facing an end surface of the terminal portion. An end surface protruding portion is provided on at least one of the end surface and the end surface facing portion.