The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Jul. 24, 2018
Applicant:
Microlink Devices, Inc., Niles, IL (US);
Inventors:
Christopher Youtsey, Libertyville, IL (US);
Robert McCarthy, Chicago, IL (US);
Rekha Reddy, Chicago, IL (US);
Assignee:
MICROLINK DEVICES, INC., Niles, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01L 21/78 (2006.01); H01L 21/3063 (2006.01); H01L 33/00 (2010.01); H01L 21/02 (2006.01); H01L 31/0236 (2006.01); H01L 21/67 (2006.01); H01L 29/20 (2006.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 21/30612 (2013.01); H01L 21/0254 (2013.01); H01L 21/02389 (2013.01); H01L 21/02458 (2013.01); H01L 21/02664 (2013.01); H01L 21/30635 (2013.01); H01L 21/67075 (2013.01); H01L 21/67086 (2013.01); H01L 21/78 (2013.01); H01L 21/7813 (2013.01); H01L 29/2003 (2013.01); H01L 31/02363 (2013.01); H01L 33/0075 (2013.01); H01L 33/22 (2013.01);
Abstract
Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.