The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Mar. 11, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Shinichiro Kuroiwa, Nagaokakyo, JP;

Kazuo Hattori, Nagaokakyo, JP;

Isamu Fujimoto, Nagaokakyo, JP;

Yasuyuki Sekimoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 4/228 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01);
Abstract

An electronic component includes a component main body including an embedded internal conductor and an outer electrode. The component main body includes an end surface on which the internal conductor is exposed, and a main surface that is continuous with the end surface and intersects with the end surface. The outer electrode includes an end surface covering portion connected to the internal conductor by covering at least a portion of the internal conductor exposed on the end surface, and a main surface covering portion that covers at least a portion of the main surface. At least a portion of an exposed surface of the main surface covering portion includes a Sn plating layer, and at least a portion of an exposed surface of the end surface covering portion includes a Sn—Ni layer.


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