The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Sep. 12, 2016
3m Innovative Properties Company, St. Paul, MN (US);
Matthew S. Stay, Minneapolis, MN (US);
Shawn C. Dodds, St. Paul, MN (US);
Luke A. Schroeder, Maplewood, MN (US);
Joan M. Noyola, Maplewood, MN (US);
Nicholas D. Petkovich, Roseville, MN (US);
Matthew H. Frey, Cottage Grove, MN (US);
Craig R. Schardt, Woodbury, MN (US);
Mikhail L. Pekurovsky, Bloomington, MN (US);
Ann M. Gilman, Woodbury, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
A composite article having a conductive layer on at least a portion of a flexible substrate. Electrical connectivity between various portions of the substrate can be obtained through this conductive layer. The conductive layer comprises a conductive surface, and there is a patterned layer on at least a portion of a first region of the conductive surface. The patterned layer comprises a conductive material having a surface roughness, and is in electrical contact with the conductive surface. An overcoat layer is present on at least a portion of the first region, such that the overcoat layer has a thickness less than the surface roughness, such that the conductive layer within the first region is covered by the overcoat layer, and such that at least a portion of the patterned layer substantially protrudes above the overcoat layer. The protruding portion permits electrical contact with the patterned layer, and via the conductive layer to other parts of the patterned layer and/or electrically conductive connectors to external electronic devices. Methods for forming the composite article are also disclosed. Methods of making such composite articles are also disclosed.