The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Sep. 28, 2018
Fujin Precision Industrial (Jincheng)co., Ltd., Jincheng, CN;
Wu-Kuang Chen, New Taipei, TW;
Shin-Lo Chia, Fremont, CA (US);
Zhi-Ming Li, Shenzhen, CN;
Le-Peng Wei, Shenzhen, CN;
Fujin Precision Industrial (Jincheng)Co., Ltd., Jincheng, CN;
Abstract
A high-density fiber array unit includes a plurality of substrates arranged and connected in an array, a side plate arranged at one side of the plurality of substrates and connected to one of the plurality of substrates, and a plurality of fibers. Each substrate comprises a first surface and a second surface opposing the first surface, and the first surface defines positioning grooves. The side plate is connected to the first surface of one of the substrates, and each fiber can be fixed to and held by a positioning groove. A fiber array apparatus including the fiber array unit is also provided.